MIT's FUTUR-IC research program, funded by the NSF Convergence Accelerator, has developed three novel optical couplers — evanescent, GRIN, and a third led by Professor Juejun Hu — that serve as the first 'optical bumps' analogous to solder bumps in electronics. These devices enable easier and cheaper integration of photonic chips with electronic microchips within a single package, targeting a leap from hundreds of terabits per second to over 1 petabit per second in data transmission. The program also addresses sustainability concerns around semiconductor carbon emissions and e-waste, and has developed the Earthster tool for supply chain carbon analysis alongside workforce development initiatives.
Nguồn: https://news.mit.edu/2026/mit-researchers-advance-toward-greater-bandwidth-more-energy-efficient-0630. 8sync News chỉ tóm tắt và dẫn link; bản quyền nội dung thuộc tác giả và nguồn gốc.