#ibm

IBM joins OpenAI’s cyber program to bring frontier AI into enterprise security

IBM tham gia chương trình Đối tác Cyber Daybreak của OpenAI và ra mắt dịch vụ bảo mật ứng dụng dựa trên AI, sử dụng mô hình của OpenAI để phát hiện lỗ hổng phần mềm nhanh hơn các trình quét truyền thống. Dịch vụ này hoạt động trong môi trường của khách hàng với quyền truy cập chỉ đọc mã nguồn để giảm cảnh báo sai. IBM cũng hỗ trợ Project Lightwell, sáng kiến 5 tỷ USD cùng Red Hat nhằm tăng cường bảo mật chuỗi cung ứng open-source bằng các mô hình AI tiên tiến.

Lập trình viên nên đọc để hiểu cách AI tiên tiến như OpenAI đang thay đổi cách phát hiện lỗ hổng an ninh phần mềm, giúp tối ưu hóa hiệu quả phát triển ứng dụng và bảo mật mà không cần phụ thuộc vào công cụ truyền thống.

The Download: Europe’s heat wave hits the grid, and IBM’s chip targets Moore’s Law

MIT Technology Review's daily briefing covers several major stories: IBM has unveiled a prototype chip with ~100 billion transistors on a fingernail-sized area, doubling transistor density from 2021 and potentially extending Moore's Law by building transistors upward rather than shrinking them. Europe is experiencing a record heat wave straining power grids, with some plants offline during historically planned maintenance windows. Anthropic has accused Alibaba of illicitly extracting Claude's capabilities via model distillation, calling it the largest known distillation attack. OpenAI and Broadcom revealed their first jointly designed AI chip called Jalapeño. Additional items cover the EU joining a US pact against Chinese AI, data center-driven inflation in memory chips, and companies struggling to control AI token spending costs.

IBM claims major chip breakthrough

IBM has announced the world's first sub-1nm chip technology, dubbed the 0.7nm (7-angstrom) node. The breakthrough uses a new transistor design called 'nanostack,' which stacks transistors in three dimensions rather than laying them flat. The result is nearly 100 billion transistors on a fingernail-sized chip — roughly twice the density of IBM's 2nm chip from 2021 — delivering up to 50% higher performance or 70% greater energy efficiency. IBM says commercial production could begin within five years, though no manufacturing partner has been announced yet. The news comes as chipmakers race to meet the growing compute demands of AI workloads, with Intel also recently advancing its 1.8nm 18A process.

IBM says it has built the first sub-1nm chip technology

IBM has announced the world's first sub-1nm chip technology at the 0.7nm (7-angstrom) node, built on a new 3D architecture called 'nanostack.' Rather than shrinking transistors on a flat plane, nanostack stacks them vertically using 3D sequential integration, enabling nearly 100 billion transistors on a fingernail-sized chip — roughly twice the density of IBM's 2021 2nm chip. IBM claims up to 50% more performance or 70% better energy efficiency versus that generation, along with 40% SRAM scaling. The architecture was validated with a working CMOS inverter at VLSI 2026. Key caveats: IBM sold its manufacturing business in 2014, so this is a research milestone rather than a shipping product, with production estimated at least five years away.

IBM has unveiled chip technology that could help extend Moore’s Law another decade

IBM has announced a prototype chip using a new 'nanostack' architecture that vertically stacks two layers of transistors on a single silicon chip, achieving roughly 100 billion transistors on a fingernail-sized area — double the density of its 2021 state-of-the-art. The design, classified as a complementary field-effect transistor (CFET), promises up to 50% more performance and 70% better energy efficiency compared to IBM's previous generation. IBM distinguishes its approach by staggering the second transistor layer rather than stacking directly on top, simplifying wiring and improving alignment precision. Key manufacturing challenges remain, including thermal budget constraints (keeping processes below 400°C) and higher defect rates from multi-layer fabrication. IBM plans to partner with semiconductor manufacturers to bring the technology to GPUs, CPUs, and data center chips within a decade, potentially extending Moore's Law by 10–15 years.